| Test
Item |
Test
Method |
| Mechanical
Performance Tests: |
| Leakage
test |
Fine
Leak: Should be less than 5x10-8 atmCC/secby
holium leak detector.
Gross Leak: Should be immersed in hot water(90¡Ó5¢J)for 5 Minutes resulting
no buble generated around it. |
| Shock
test |
Orient
the sample in any attitude and drop it three times from a height of
50cm onto a hardwood board with a thickness of 3cm. |
| Resistance
to soldering heat |
Dip
terminal in a 260¡Ó5¢J solder bath for 10¡Ó0.5 seconds The solder shell
leave an undipped lead an undipped terminal length og 2mm at their
base. |
| Bending
strength |
Apply
a 500g load to one of the terminals, and after tilting the unit Resonator
for 90¢X,restore to its original attitude. The tilt it in an opposite
direction for 90¢X and restore to its original attitude. |
| Lapping
Precision Lapping |
To
lap a quartz crystal to the extent of the prescribed thickness and
frequency. |
| Tensile
strength |
After
pasting together the thickness lapped quartz crystal, process them
to the prescribed dimensions. |
| Beveling |
Apply
a 1.5kg tensile load to terminal and sustain it for 30¡Ó5 seconds. |
| Environmental
Tests: |
| Storage
In Low Temperature |
Expose
the sample in an inoperative mode to 500 hours in a -40¢J Environment. |
| Storage
In High Temperature |
Expose
the sample in an inoperative mode to 500 hours of a +85¢J Environment. |